By Jerry Luecke
, Page xi
, Page xii
, Page xiii
What's at the CD-ROM?
, Page xiv
Chapter 1 - sign Paths from Analog to Digital
, Pages 1-10
Chapter 2 - sign Paths from electronic to Analog
, Pages 11-17
Chapter three - Sensors
, Pages 18-34
Chapter four - sign Conditioning
, Pages 35-65
Chapter five - Analog-to-Digital and Digital-to-Analog Conversions
, Pages 66-81
Chapter 6 - electronic procedure Processing
, Pages 82-102
Chapter 7 - Examples of Assembly-Language Programming
, Pages 103-141
Chapter eight - facts Communications
, Pages 142-159
Chapter nine - procedure strength and Control
, Pages 160-173
Chapter 10 - A Microcontroller Application
, Pages 174-199
Appendix A - The MSP430 guide Set
, Pages 200-259
Appendix B - normal sign in and Bit Definitions for the MSP430 Microcontrollers
, Pages 260-272
Appendix C - program application to be used in bankruptcy 10
, Pages 273-289
Appendix D - A Refresher
, Pages 290-297
About the Author
, Page 299
, Pages 300-312
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Content material: Foreword, web page xiPreface, web page xiiAcknowledgments, web page xiiiWhat's at the CD-ROM? , web page xivChapter 1 - sign Paths from Analog to electronic, Pages 1-10Chapter 2 - sign Paths from electronic to Analog, Pages 11-17Chapter three - Sensors, Pages 18-34Chapter four - sign Conditioning, Pages 35-65Chapter five - Analog-to-Digital and Digital-to-Analog Conversions, Pages 66-81Chapter 6 - electronic approach Processing, Pages 82-102Chapter 7 - Examples of Assembly-Language Programming, Pages 103-141Chapter eight - facts Communications, Pages 142-159Chapter nine - process strength and keep an eye on, Pages 160-173Chapter 10 - A Microcontroller program, Pages 174-199Appendix A - The MSP430 guideline Set, Pages 200-259Appendix B - usual check in and Bit Definitions for the MSP430 Microcontrollers, Pages 260-272Appendix C - software application to be used in bankruptcy 10, Pages 273-289Appendix D - A Refresher, Pages 290-297About the writer, web page 299Index, Pages 300-312
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Additional info for Analog and Digital Circuits for Electronic Control System Applications. Using the TI MSP430 Microcontroller
The voltage, V o, is calibrated to the pressure to complete the sensor characteristics. Pressures from 0-500 psi (pounds per square inch) can be measured with such a pressure sensor. If R1, R:, and R 3 all equal 10 kf2, when Rx varies from 10 kf2 to 20 kf2, the output voltage will be approximately from 10 mV to 20 mV per 1 kf2 of resistance change. One of the advantages of the silicon substrate sensors is that other integrated circuits can be in and on the silicon to provide signal conditioning to the voltage output, Vo.
Frequency Compensation Frequency compensation is the act of adding external components to stabilize the op amp and keep it from oscillating. Some op amps provide pin connections to which external capacitance can be connected to stabilize the op amp. This feature is shown for the package of Figure 4-18. " When the application demands more and more frequency response and higher frequency operation, more attention must be paid to circuit layout and lead lengths to keep the op amp from oscillating.
Biasing Vcc = + 1 2 V The operating point A is set at its operating characteristics by biasing the circuit. There are a number of biasing circuits: fixed-current Ia bias, voltage-divider bias, collector-feedback bias. This design will use voltagedivider bias. The circuit looks like the one in Figure 4-4. The resistor RE is placed in the circuit to provide negative feedback. This feedback and its effect on circuit performance will be discussed when op amps and oscillators are discussed. For now, the presence of RE in the circuit gives the circuit more stability against changes in temperature or parameter values.